Skip to McMaster Navigation Skip to Site Navigation Skip to main content
McMaster logo

X-ray CT

Nikon M2 225 KV CT

The Nikon M2 225 KV CT is a high-performance X-ray computed tomography (CT) scanner with the max voltage of 225 KV and max power of 450 W. The X-ray source in the scanner is a tungsten target that is bombarded with high-energy electrons. With its advanced technology, this scanner provides fast and accurate 3D imaging of a wide range of materials, including metals, plastics, composites, and more, allowing for non-destructive testing, quality control, and materials research. It features a large field of view and a high-resolution detector, enabling users to examine the internal structure of objects with unprecedented detail and accuracy.

Specifications:

  • X-ray tube voltage: 50 – 225 kV
  • Detector type: flat-panel
  • Field of view: up to 300 mm in diameter and 500 mm in length
  • Magnification: geometric
  • Spatial resolution: up to 3 µm

Contact Pardis Mohammadpour for more information.

Zeiss Xradia 630 Versa

The Zeiss Xradia 630 Versa is a high-resolution 3D X-ray microscope for non-destructive imaging of wide variety of sample types and length scales, from the sub-micron to millimeter range. This system can deliver exceptional resolution performance (450 nm with the maximum achievable voxel size of 40 nm) for the entire energy range of 30 kV to 160 kV, maximum, 25 W. This X-ray Microscope (XRM) comes with a dual-stage magnification feature that uses advanced synchrotron-caliber optics and ground-breaking RaaD™ (Resolution at a Distance) technology to provide high resolution even at large working distances. The combination of the detector designs, from objectives to the flat panel extension (FPX), enables the efficient and accurate study of a broad spectrum of sample sizes and types.

Moreover, this X-ray microscope enables to retrieve the 3D crystallographic data using a technique called Laboratory-based Diffraction Contrast Tomography (LabDCT). LabDCT is a non-destructive imaging process used in this microscope to obtain three-dimensional images of the crystallographic structure of a wide range of materials, including metals, alloys, ceramics, and geological specimens. It works by analyzing the diffraction pattern of X-rays as they pass through a sample, providing information about the microstructure, texture, and strain of a material, making it a useful tool for materials science research and industrial applications. By combining DCT with tomography, which involves taking multiple two-dimensional images from different angles and reconstructing them into a 3D image, researchers can obtain detailed information about the crystallographic structure of a material in all three dimensions.

Finally, using AI-based reconstruction technology, ZEISS DeepRecon Pro can achieve up to 10 times faster throughput or higher quality images for Unique, Semi-repetitive, and Repetitive sample workflows.

Specifications:

  • X-ray tube voltage: 30 – 160 kV
  • Detector type: flat-panel detector, objectives (0.4X, 4X, 20X, 40X-Prime)
  • Maximum field of view: up to 140 mm in diameter, 93 mm (single) and 165 mm (stitched) in height.
  • Magnification: geometric, optical lens
  • Spatial resolution: 450 nm with the maximum achievable voxel size of 40 nm
  • Maximum mass capacity: 25 kg

Contact Pardis Mohammadpour for more information.