Zeiss NVision 40
The Zeiss NVision40 is a dual-beam instrument combining a Schottky field emission SEM with a focused beam of gallium ions. The combination of FIB and SEM allows an area of interest to be identified and extracted, most often for fabrication into a thin-foil specimen for TEM analysis or into needles for Atom Probe Tomography, but also for other applications involving the precise and controlled removal of material at the micro and nano scales.
This instrument can be used for 3D FIB tomography, which is a technique where incrementally milling and imaging a volume of material yields a stack of images that can be processed into a 3D data set. The NPVE add-on by Fibics Inc. enables high-quality 3D FIB data acquisition as well as a more complex patterning capability.
An energy dispersive X-ray spectrometer (EDXS) equipped with a silicon drift detector can be used to assist in the selection of the region of interest and enables compositional analysis of cross-sections revealed by FIB cuts into the surface of a specimen.
Milling at cryogenic temperature is also possible with the Leica EM VCT100 cryo shuttle and cold stage add-on. The specimen can be kept cold and under vacuum during both insertion into and removal from the FIB.
Thermo Scientific Helios G4 UXe DualBeam Plasma-FIB
The Helios G4 PFIB provides the capacity to perform large area (up to 1 mm2) cross-sectioning, large 3D volume (up to 200 µm × 200 µm × 200 µm) characterization, and Ga+ free sample preparation by using an inductively coupled Xe+ plasma (ICP) source with an ion current that can reach as high as 2.5 µA. A field emission gun (FEG) and an UniColore (UC+, second generation chromatic aberration corrector) enhanced electron column enables imaging beam-sensitive (e.g. biological, polymer, graphene-based, etc.) samples at sub-nanometer resolution utilizing sub-500 eV probes.
The FIB is a micro-milling instrument with capabilities that include micro-machining, site-specific TEM thin-foil specimen preparation, consecutive sectioning and imaging to produce 3-D tomographic images, device circuit editing, micro-surgery and device modification. The addition of a STEM (scanning transmitted electron microscopy) detector, that permits analysis of nano-sized particles placed on TEM grids, as well as a SI/SE (secondary ion and electron) detector broadens its capabilities.