Transmission Electron Microscopes
TFS Spectra Ultra
The TFS Spectra Ultra is an ultra-high-resolution, double-corrected HRTEM/STEM that operates at 30, 60, 200, and 300 keV. A X-FEG source and an ultimono monochromator (10 meV at 60 kV) and Ultra-X EDS detector makes this instrument well suited for high-energy-resolution analytical work down to single atoms.
Specifications
- X-FEG
- 30 keV, 60 keV, 200 keV, 300 keV
- Ultimono monochromator, (10 meV at 60 kV)
- Cs Probe and Image corrector (STEM resolution: 0.5 A at 300 kV / Information limit: 0.7 A)
- S-TWIN’ polepiece – constant thermal load, <15 min stabilization when switching kV’s
- Ultra-X EDS Detector
- HAADF + Panther STEM segmented detectors (DPC / iDPC)
- Tomography (Imaging/EDS)
- 4D-STEM using Ceta S Detector
- OptiSTEM+: automated corrector alignments
- OptiMono+: automated monochromator alignments
- Gatan ContinuumK3 GIF (EELS / EFTEM)
FEI Titan 80-300 LB
The Titan 80-300 LB is a high-resolution, image-corrected HRTEM/STEM that operates at 80 and 300 keV. A high-brightness source and a monochromator make this TEM well suited for high-energy-resolution analytical work including energy-filtered imaging. A cryogenic capability and the option to acquire and analyze electron tomography data are also available.
Specifications
- XFEG source
- monochromator
- large-gap Cryo-Twin objective lens
- CEOS hexapole aberration corrector on the image-forming lens
- Gatan Tridiem Spectrometer (0.25eV resolution)
- single- and double-tilt holders, tomography holder, cryo-holder, heating holder
Talos 200X
The Thermo Scientific Talos 200X is an analytical TEM and STEM equipped with an X-FEG source and an adjustable high tension between 80 and 200 kV.
The instrument supports HRTEM with a resolution of 0.1 nm and STEM with a resolution of 0.16 nm.
It is equipped with four in column SDD Super- X detectors for energy dispersive X-ray spectroscopy (EDS) signal detection and chemical characterization with compositional mapping . This allows for the fastest and the most precise EDS analysis in 2D and 3D.
A CMOS detector for EELS acquisition with a measured energy resolution of 0.65 eV.
The CETA 16M CMOS camera provides large area high framerate image acquisition capabilities, allowing for imaging of beam sensitive materials and low dose imaging.
Talos L120C
The Thermo Scientific Talos L120C is a general purpose analytical TEM equipped with a LaB6 filament and an adjustable high tension between 20-120kV.
The instrument supports bright field or dark field TEM (information limit 0.36 nm @ 120kV), diffraction and scanning transmission electron microscopy (STEM).
A Bruker XFlash 6TI30 EDS detector provides chemical mapping capabilities. The 4k CETA CMOS camera provides large area high framerate image acquisition capabilities.
The microscope excels at imaging of beam sensitive materials, as well as metals and ceramics and is very user friendly. It serves as the primary training instrument for TEM at the facility.
Nion HERMES 100
The Nion HERMES 100 is a STEM instrument equipped with a probe corrector, monochromator and spectrometer that allows imaging and spectroscopy with both high spatial and ultra-high energy resolution. This microscope will image your specimens at atomic resolution, identify features in it by imaging, diffraction, and spectroscopy, obtain spatially resolved EELS maps, and perform many other nanoscale characterization activities.
Specifications:
FEG source
30keV, 60keV, 100keV
Monochromator
Probe-corrector
Spectrometer
Spatial resolution (sub 1 A at 60 KV)
Energy resolution (sub 5 meV at 60 KV)
Single- and double-tilt holders
The JEOL 1200EX is a very user friendly TEM equipped with a tungsten filament and an adjustable high tension between 60-120kV. Grid exchange is quick, the goniometer allows for 35 degree tilting of specimen rod and a rotational holder is available. The pole piece design provides excellent contrast for biological samples and there is minimal sample damage at 80kV. The microscope is equipped with an AMT 4 megapixel digital camera.
Scanning Electron Microscopes
FEI Magellan 400
The FEI Magellan 400, an extreme high-resolution SEM with sub-nanometer resolution, operates at 1 to 30keV. An in-situ plasma cleaner and a liquid nitrogen cold finger allow for the analysis of highly labile and sensitive materials. SEM analysis of non-conductive materials, carried out at low beam energies, enables characterization of sub-nanometer surface structures. Novel detectors such as the high collection efficiency in-lens detector and a unique low voltage, high contrast solid state detector, combined with a two-mode objective lens with beam deceleration and immersion capabilities, provide high surface sensitivity, high resolution and enhanced contrast at low voltages.
JEOL JSM-7000F
The JEOL JSM-7000F equipped with a Schottky field emission gun offers high resolution and large probe currents at small probe diameters permitting characterization of nano-scale structures. A multipurpose specimen chamber, motorized specimen stage, single-action specimen exchange and an ideal geometry for techniques such as energy dispersive spectroscopy, electron backscattered diffraction and e-beam lithography are also features of this instrument. Resolutions of 1.2nm at 30keV and 3.0nm at 1keV make it an ideal instrument for the study of nano-scale non-conductive materials, polymers, ceramics and semi-conductors. Integrated Oxford Instruments X-Maxn 50 mm2 EDS detector and Nordlys II EBSD Camera with AZtec EDS/EBSD software plus HKL Channel EBSD post-processing software for the simultaneous acquisition of elemental (Boron and higher Z-number elements) and crystal orientation data, permitting a complete characterization of poly-phase samples.
JEOL 6610LV
The JEOL 6610LV is a tungsten filament equipped SEM with selectable low vacuum mode that allows for the analysis of non-conductive specimens without the need for heavy-metal coating. It has a large chamber which enables observation of specimens up to 200mm in diameter. With a resolution of 3.0nm at 30keV it is possible to view secondary electron and backscattered composition images simultaneously, which allows the user to contrast and compare specific details of the sample while carrying out EDS analysis.
Quattro S ESEM
The Thermo Scientific Quattro ESEM, environmental SEM allows for the study of materials in a range of conditions, such as metals, natural state materials (ESEM), hot, wet/humid, or reactive. It supports cooling and heating experiments both in high vacuum and low vacuum to accommodate the widest range of study environments. Due to its chamber size the Quattro, allows various accessories to be used for in-situ experiments, wet materials are possible with the Peltier cooling stage.
Elemental information can be obtained with Thermo Scientific ChemiSEM Technology, which provides live, quantitative, elemental mapping with SEM software. Thermofisher Pathfinder EDS system and X-ray microanalysis can be used for fast and excellent analysis of non-conductive samples: accurate EDS in high vacuum and low vacuum with the Quattro ESEM’s through-the-lens pumping.
- Resolution:
- 0.8 nm at 30 kV (STEM) in high vacuum
- 1.0 nm at 30 kV (SE) in high vacuum
- 1.3 nm at 30 kV (SE) in low vacuum and ESEM mode
- 3.0 nm at 1 kV (SE)
- ETD, low-vacuum SED (LVD), gaseous SED for ESEM mode (GSED), IR camera
- Nav-Cam+, DBS, DBS-GAD, ESEM-GAD
- Live quantitative SEM image coloring is available based on energy-dispersive X-ray spectroscopy (EDS). Point & ID, linescan, region, element maps.
- Stage bias (beam deceleration): -4000 V to +50 V
- Low vacuum mode: Up to 2600 Pa (H2O) or 4000 Pa (N2)
- Stage: 5-axis motorized eucentric stage, 110 x 110 mm² with a 105° tilt range.
- Maximum sample weight: 5 kg in un-tilted position.
- Standard sample holder and standard multi-sample SEM holder uniquely mounts directly onto the stage, hosts up to 18 standard stubs (12 mm), does not require tools to mount the samples
- Chamber: 340 mm inside width, Tilt: -15° – 90°, X: -55mm – +55mm Y: -55mm – +55mm
- In situ accessories:
- Software controlled: Peltier cold stage
Software controlled: low vacuum/ESEM heating stage
Software controlled: high vacuum heating stage
- Software controlled: Peltier cold stage
TESCAN VP. SEM
The TESCAN VEGA-II LSU SEM is a variable pressure SEM equipped with a tungsten filament. Conductive samples are viewed via a high vacuum mode while non-conductive samples can be viewed under low vacuum conditions. The microscope has a large chamber and an IR chamber CCD camera to allow viewing inside the chamber during use and the stage holds 7 stubs (13mm diameter) at one time and allows for 360 degree rotation and 50 degree tilt . SE and BSE imaging can be done simultaneously and a Peltier cooling stage is available (temperature control to -500C). The microscope is equipped with an X-MAX 80mm2 EDS detector and INCA software.
Focused Ion Beam
Thermo Scientific Helios 5 PFIB UXe DualBeam Plasma-FIB
The Helios 5 plasma focused ion beam (PFIB) provides the capacity to perform large area (up to 1 mm2) cross-sectioning, large 3D volume (up to 200 µm × 200 µm × 200 µm) characterization, and Ga+ free sample preparation by using an inductively coupled Xe+ plasma (ICP) source with an ion current that can reach as high as 2.5 µA. A field emission gun (FEG) and an UniColore (UC+, second generation chromatic aberration corrector) enhanced electron column enables imaging beam-sensitive (e.g. biological, polymer, graphene-based, etc.) samples at sub-nanometer resolution utilizing sub-500 eV probes.
Analytical capabilities: Oxford Instruments Ultim Max 100 electron-dispersive X-ray spectroscopy (EDS) and Symmetry S2 electron backscatter diffraction (EBSD) detectors
Zeiss Orion NanoFab
The Zeiss Orion NanoFab is a dual beam instrument with two different FIB columns. The primary is a gas field ion source (GFIS) column which uses either He or Ne, and the second is a liquid metal ion source Ga column.
The GFIS column offers several key advantages over either conventional SEM or FIB systems. When imaging with He ions, the Orion can achieve up to 0.5 nm imaging resolution, and with a depth of field that is 5-10x that of a normal field emission SEM. By combining He ion imaging with an electron flood gun, the Orion is also capable of imaging many non-conductive, charging samples, without requiring additional sample preparation steps (e.g. metal coating).
The He ion beam is also capable of fine-scale milling and patterning (<10 nm) to create precise and delicate structures or features. Using Ne instead of He for the GFIS offers an improved milling rate with a trade-off on resolution, and the conventional Ga FIB beam is useful for high rate material removal.
The combination of these two beams and three ion sources make the Orion a versatile platform for high resolution and high precision imaging, patterning, and advanced nanofabrication.
Thermo Fisher Helios 5 UC
Installed in 2022, the Helios 5 is a modern workhorse FIB that CCEM has targeted to be used by both CCEM staff and users for efficiently performing typical FIB tasks such as cross-section analysis and sample preparation for TEM and APT.
It is equipped with an assortment of detectors; ETD, TLD, ICE, MD, and ICD; many with backscattered electron modes. For EDS there is a ThermoScientific Pathfinder EDS detector. The Helios 5 is also equipped with in-chamber Navigation and IR Cameras, plasma cleaner, electron flood gun for FIB charge neutralization, cryo-cleaner decontamination device, and AutoTEM 5 software.
The 30 kV Ga ion beam ranges from 1 pA to 100 nA, enabling both precise nano-scale patterning and fast material removal. The voltage can go as low as 500 V for gentle cleaning with minimal ion penetration depth.
The MultiChem gas-delivery system enables site-specific deposition of tungsten, platinum, and carbon. There is also a gas for selected carbon etching.
The Easy-lift offers easy and efficient in-situ micromanipulation.
The stage is high-precision piezo-driven, with a Z-range of 10 mm and tilt range of -10 to 60 degrees.
The electron beam current ranges from 0.8 pA to 100 nA and the voltage from 350V to 30kV. An Immersion Lens design with UC+ monochromator enables very high-resolution SEM imaging using low voltage and low current. Drift-compensated frame integration further helps to reduce noise and handle the imaging of non-conductive and beam-sensitive specimens. Up to 4000 V beam deceleration can also be applied to the specimen.
More microscope information and specifications are available at the Thermo Scientific webpage for the Helios 5 UC: Helios 5 UC DualBeam
Zeiss Crossbeam 350 with Laser
Installed in 2022, the Crossbeam 350 at CCEM is fully-equipped to handle a wide variety of scenarios, highlighted by a femtosecond laser that enables massive volumes of material ablation in addition to all the full functionality of a FIB-SEM.
The femtosecond laser is attached to the airlock to avoid chamber contamination, yet the laser positioning is still registered to the SEM image to enable site-specific laser ablation of specimens at rates that are orders of magnitude greater than the removal rate of even a plasma-FIB. Access to the millimetre scale is routine work for this laser. The femtosecond laser ablates material so quickly that there is almost no significant damage or heat-affected zone. Additionally, the Crossbeam 350 at CCEM is the first Zeiss Laser FIB installation in the world with “Burst Mode”, which further improves efficiency.
The Crossbeam 350 is equipped with SE2 and InLens secondary electron detectors as well as an in-column energy-selective backscattered (ESB) detector and an retractable 4-quadrant annular backscattered electron detector. There are 2 IR Cameras to assist with navigation as well as one in the airlock. The airlock enables efficient sample transfer without the need to vent the specimen chamber.
The 30 kV Ga ion beam ranges from 1 pA to 100 nA, enabling both precise nano-scale patterning and fast material removal. The voltage can go as low as 500 V for gentle cleaning with minimal ion penetration depth.
Two gas-injection systems enable site-specific deposition of tungsten or carbon. A Kleindiek MM3 micromanipulator with rotation enables in-situ micromanipulation.
The stage has a large Z-range of up to 50 mm and tilt ranges from -4 to 70 degrees.
The electron imaging current spans 5pA to 100nA and the voltage from 0.02kV to 30kV.
Future add-ons to the Crossbeam 350 at CCEM include a Leica cryo system with cold vacuum transfer capability, Fibics scan generator with Atlas 5 software, correlation with 3D X-ray micro-CT data, and more.
More microscope information and specifications, are available at the Zeiss webpage for the Crossbeam family of FIB-SEMs: ZEISS Crossbeam Family
Atom Probe Tomography
Cameca LEAP 5000 XS
The Local Electrode Atom Probe (LEAP) 5000 XS from CAMECA Instruments Inc. is a high-resolution material analysis system that provides quantitative three-dimensional elemental and isotopic mapping with sub-nanometre resolution. Materials are examined by successive field-evaporation of ions. The collected data is then reconstructed to yield a 3D computer model of the material, offering an unparalleled combination of spatial and compositional accuracy.
The wide field-of-view and improved ion optics of the LEAP 5000 XS provide high-quality spatial resolutions, whereas new detector technologies provide unmatched multi-hit detection capabilities and detection efficiencies for more accurate compositional measurements.
In addition to the traditional method of high voltage pulsing to induce field evaporation, laser capabilities using an ultraviolet laser (355 nm wavelength) expand the range of potential materials beyond metals and alloys to semiconductors, ceramics, minerals, and biomaterials. A large range of pulse repetition rates offered by the LEAP 5000 system provides fast data acquisition times, while the live-time mass-spectrum calibration and 3D data reconstruction allows for improved data quality.
An equipped Vacuum and Cryo Transfer Module (VCTM) enables cryogenic and/or air sensitive materials to be prepared in the Focused Ion Beam (FIB) and transferred to the LEAP 5000 XS for analysis, further expanding the potential of APT to study new materials, such as soft materials and liquid-solid interfaces.
Finally, the latest version of the CAMECA AP Suite 6 software allows users to work through their APT data easily and efficiently, with analytical capabilities including the characterisation of dopants in semiconductors, alloying elements in steels, trace element segregation to interfaces and clusters, isotope ratio measurements in minerals, and the generation of 1D concentration profiles and 2D maps with atomic sensitivity.
Auger Spectroscopy
JEOL JAMP-9500F FE-Auger
The field emission Auger microprobe is a high-sensitivity instrument for surface analysis. It has very high spatial resolution, with a minimum probe diameter of 8nm, and high energy resolution. Using a hemispherical electrostatic energy analyser with a large acceptance angle and a multi-channel detector, elements can be detected with concentrations as low as 0.2 atomic%, although higher concentrations are required for accurate quantification.
An incorporated SEM provides images of the sample and an EDXS detector provides quick preview analysis allowing precise selection of the location for point spectra, line scans, depth profiling, and Auger image mapping. EDXS is a very unusual capability in an Auger instrument; this JAMP was the first where an EDXS detector was successfully installed, overcoming challenges of the UHV environment.
Selected volumes can be milled away with the in-situ ion gun, allowing depth profiling to a depth of a few hundred nanometres. The ion beam can also be used to remove contamination and to neutralize surface charging for non-conductive samples.
X-ray CT
Nikon M2 225 KV CT
The Nikon M2 225 KV CT is a high-performance X-ray computed tomography (CT) scanner with the max voltage of 225 KV and max power of 450 W. The X-ray source in the scanner is a tungsten target that is bombarded with high-energy electrons. With its advanced technology, this scanner provides fast and accurate 3D imaging of a wide range of materials, including metals, plastics, composites, and more, allowing for non-destructive testing, quality control, and materials research. It features a large field of view and a high-resolution detector, enabling users to examine the internal structure of objects with unprecedented detail and accuracy.
Specifications:
- X-ray tube voltage: 50 – 225 kV
- Detector type: flat-panel
- Field of view: up to 300 mm in diameter and 500 mm in length
- Magnification: geometric
- Spatial resolution: up to 3 µm
Zeiss Xradia 630 Versa
The Zeiss Xradia 630 Versa is a high-resolution 3D X-ray microscope for non-destructive imaging of wide variety of sample types and length scales, from the sub-micron to millimeter range. This system can deliver exceptional resolution performance (450 nm with the maximum achievable voxel size of 40 nm) for the entire energy range of 30 kV to 160 kV, maximum, 25 W. This X-ray Microscope (XRM) comes with a dual-stage magnification feature that uses advanced synchrotron-caliber optics and ground-breaking RaaD™ (Resolution at a Distance) technology to provide high resolution even at large working distances. The combination of the detector designs, from objectives to the flat panel extension (FPX), enables the efficient and accurate study of a broad spectrum of sample sizes and types.
Moreover, this X-ray microscope enables to retrieve the 3D crystallographic data using a technique called Laboratory-based Diffraction Contrast Tomography (LabDCT). LabDCT is a non-destructive imaging process used in this microscope to obtain three-dimensional images of the crystallographic structure of a wide range of materials, including metals, alloys, ceramics, and geological specimens. It works by analyzing the diffraction pattern of X-rays as they pass through a sample, providing information about the microstructure, texture, and strain of a material, making it a useful tool for materials science research and industrial applications. By combining DCT with tomography, which involves taking multiple two-dimensional images from different angles and reconstructing them into a 3D image, researchers can obtain detailed information about the crystallographic structure of a material in all three dimensions.
Finally, using AI-based reconstruction technology, ZEISS DeepRecon Pro can achieve up to 10 times faster throughput or higher quality images for Unique, Semi-repetitive, and Repetitive sample workflows.
Specifications:
- X-ray tube voltage: 30 – 160 kV
- Detector type: flat-panel detector, objectives (0.4X, 4X, 20X, 40X-Prime)
- Maximum field of view: up to 140 mm in diameter, 93 mm (single) and 165 mm (stitched) in height.
- Magnification: geometric, optical lens
- Spatial resolution: 450 nm with the maximum achievable voxel size of 40 nm
- Maximum mass capacity: 25 kg