CCEM strives to push the cutting edge of materials characterization that best enables strategically important materials breakthroughs. We can accomplish this through our unique suite of instrumentation from electron and ion microscopes, and our dedicated staff. All users have the opportunity to be trained on any instrument at CCEM.
FEI Titan 80-300 HB
The Titan 80-300 HB is a double aberration-corrected TEM/STEM that can operate at multiple accelerating voltages to allow imaging of a variety of materials, including beam-sensitive samples. The instrument achieves sub-Ångstrom resolution both for phase contrast imaging and STEM. A monochromator allows 0.1eV energy resolution for high-resolution electron energy loss spectroscopy.
The Titan HB is used for atomic-resolution imaging and detailed chemical analysis, giving both composition and chemical state, of a wide variety of materials. Some recent examples are novel compositions and structures for LEDs, safety-critical materials for nuclear power, and nano-particles for biomedical applications.
- XFEG source
- 80keV, 200keV, 300keV
- CEOS hexapole aberration correctors on image- and probe-forming lenses
- Super-Twin objective lens
- Gatan Quantum GIF (0.1 eV resolution)
- Gatan K2 Summit® direct electron detection camera
- single- and double-tilt holders, tomography holder, cryo-holder, heating holder
FEI Titan 80-300 LB
The Titan 80-300 LB is a high-resolution, image-corrected HRTEM/STEM that operates at 80 and 300 keV. A high-brightness source and a monochromator make this TEM well suited for high-energy-resolution analytical work including energy-filtered imaging. A cryogenic capability and the option to acquire and analyze electron tomography data are also available.
- XFEG source
- large-gap Cryo-Twin objective lens
- CEOS hexapole aberration corrector on the image-forming lens
- Gatan Tridiem Spectrometer (0.25eV resolution)
- single- and double-tilt holders, tomography holder, cryo-holder, heating holder
The Thermo Scientific Talos 200X is an analytical TEM and STEM equipped with an X-FEG source and an adjustable high tension between 80 and 200 kV.
The instrument supports HRTEM with a resolution of 0.1 nm and STEM with a resolution of 0.16 nm.
It is equipped with four in column SDD Super- X detectors for energy dispersive X-ray spectroscopy (EDS) signal detection and chemical characterization with compositional mapping . This allows for the fastest and the most precise EDS analysis in 2D and 3D.
A CMOS detector for EELS acquisition with a measured energy resolution of 0.65 eV.
The CETA 16M CMOS camera provides large area high framerate image acquisition capabilities, allowing for imaging of beam sensitive materials and low dose imaging.
The Thermo Scientific Talos L120C is a general purpose analytical TEM equipped with a LaB6 filament and an adjustable high tension between 20-120kV.
The instrument supports bright field or dark field TEM (information limit 0.36 nm @ 120kV), diffraction and scanning transmission electron microscopy (STEM).
A Bruker XFlash 6TI30 EDS detector provides chemical mapping capabilities. The 4k CETA CMOS camera provides large area high framerate image acquisition capabilities.
The microscope excels at imaging of beam sensitive materials, as well as metals and ceramics and is very user friendly. It serves as the primary training instrument for TEM at the facility.
The JEOL 1200EX is a very user friendly TEM equipped with a tungsten filament and an adjustable high tension between 60-120kV. Grid exchange is quick, the goniometer allows for 35 degree tilting of specimen rod and a rotational holder is available. The pole piece design provides excellent contrast for biological samples and there is minimal sample damage at 80kV. The microscope is equipped with an AMT 4 megapixel digital camera.
FEI Magellan 400
The FEI Magellan 400, an extreme high-resolution SEM with sub-nanometer resolution, operates at 1 to 30keV. An in-situ plasma cleaner and a liquid nitrogen cold finger allow for the analysis of highly labile and sensitive materials. SEM analysis of non-conductive materials, carried out at low beam energies, enables characterization of sub-nanometer surface structures. Novel detectors such as the high collection efficiency in-lens detector and a unique low voltage, high contrast solid state detector, combined with a two-mode objective lens with beam deceleration and immersion capabilities, provide high surface sensitivity, high resolution and enhanced contrast at low voltages.
The JEOL JSM-7000F equipped with a Schottky field emission gun offers high resolution and large probe currents at small probe diameters permitting characterization of nano-scale structures. A multipurpose specimen chamber, motorized specimen stage, single-action specimen exchange and an ideal geometry for techniques such as energy dispersive spectroscopy, electron backscattered diffraction and e-beam lithography are also features of this instrument. Resolutions of 1.2nm at 30keV and 3.0nm at 1keV make it an ideal instrument for the study of nano-scale non-conductive materials, polymers, ceramics and semi-conductors. Integrated Oxford Instruments X-Maxn 50 mm2 EDS detector and Nordlys II EBSD Camera with AZtec EDS/EBSD software plus HKL Channel EBSD post-processing software for the simultaneous acquisition of elemental (Boron and higher Z-number elements) and crystal orientation data, permitting a complete characterization of poly-phase samples.
The JEOL 6610LV is a tungsten filament equipped SEM with selectable low vacuum mode that allows for the analysis of non-conductive specimens without the need for heavy-metal coating. It has a large chamber which enables observation of specimens up to 200mm in diameter. With a resolution of 3.0nm at 30keV it is possible to view secondary electron and backscattered composition images simultaneously, which allows the user to contrast and compare specific details of the sample while carrying out EDS analysis.
TESCAN VP. SEM
The TESCAN VEGA-II LSU SEM is a variable pressure SEM equipped with a tungsten filament. Conductive samples are viewed via a high vacuum mode while non-conductive samples can be viewed under low vacuum conditions. The microscope has a large chamber and an IR chamber CCD camera to allow viewing inside the chamber during use and the stage holds 7 stubs (13mm diameter) at one time and allows for 3600 rotation and 500 tilt . SE and BSE imaging can be done simultaneously and a Peltier cooling stage is available (temperature control to -500C). The microscope is equipped with an X-MAX 80mm2 EDS detector and INCA software.
Zeiss NVision 40
The Zeiss NVision40 is a dual-beam instrument combining a Schottky field emission SEM with a focused beam of gallium ions. The combination of FIB and SEM allows an area of interest to be identified and extracted, most often for fabrication into a thin-foil specimen for TEM analysis or into needles for Atom Probe Tomography, but also for other applications involving the precise and controlled removal of material at the micro and nano scales.
This instrument can be used for 3D FIB tomography, which is a technique where incrementally milling and imaging a volume of material yields a stack of images that can be processed into a 3D data set. The NPVE add-on by Fibics Inc. enables high-quality 3D FIB data acquisition as well as a more complex patterning capability.
An energy dispersive X-ray spectrometer (EDXS) equipped with a silicon drift detector can be used to assist in the selection of the region of interest and enables compositional analysis of cross-sections revealed by FIB cuts into the surface of a specimen.
Milling at cryogenic temperature is also possible with the Leica EM VCT100 cryo shuttle and cold stage add-on. The specimen can be kept cold and under vacuum during both insertion into and removal from the FIB.
Thermo Scientific Helios G4 UXe DualBeam Plasma-FIB
The Helios G4 PFIB provides the capacity to perform large area (up to 1 mm2) cross-sectioning, large 3D volume (up to 200 µm × 200 µm × 200 µm) characterization, and Ga+ free sample preparation by using an inductively coupled Xe+ plasma (ICP) source with an ion current that can reach as high as 2.5 µA. A field emission gun (FEG) and an UniColore (UC+, second generation chromatic aberration corrector) enhanced electron column enables imaging beam-sensitive (e.g. biological, polymer, graphene-based, etc.) samples at sub-nanometer resolution utilizing sub-500 eV probes.
Cameca LEAP 4000X HR
The Local Electrode Atom Probe (LEAP) 4000X HR allows for 3D analysis of materials at the sub-nanometer scale. Materials are examined by successive field-evaporation of ions. The collected data is then reconstructed to yield a 3D computer model of the material, offering an unparalleled combination of spatial and compositional accuracy. In addition to the traditional method of high-voltage pulsing to induce field evaporation, the LEAP 4000X HR also uses an ultraviolet laser (355nm wavelength). The capability for laser pulsing expands the range of potential materials for analysis from metals, alloys, semiconductors to ceramics, minerals and bio-materials. Analyses include dopants in semiconductors, alloying elements, concentration profiles with atomic sensitivity and clustering.
JEOL JAMP-9500F FE-Auger
The field emission Auger microprobe is a high-sensitivity instrument for surface analysis. It has very high spatial resolution, with a minimum probe diameter of 8nm, and high energy resolution. Using a hemispherical electrostatic energy analyser with a large acceptance angle and a multi-channel detector, elements can be detected with concentrations as low as 0.2 atomic%, although higher concentrations are required for accurate quantification.
An incorporated SEM provides images of the sample and an EDXS detector provides quick preview analysis allowing precise selection of the location for point spectra, line scans, depth profiling, and Auger image mapping. EDXS is a very unusual capability in an Auger instrument; this JAMP was the first where an EDXS detector was successfully installed, overcoming challenges of the UHV environment.
Selected volumes can be milled away with the in-situ ion gun, allowing depth profiling to a depth of a few hundred nanometres. The ion beam can also be used to remove contamination and to neutralize surface charging for non-conductive samples.